Sign In | Join Free | My himfr.com
Home > LED & Semiconductor Industry >

LED & Semiconductor Industry - Diamond Dicing Blades For Semiconductor Industry - zoe@moresuperhard.com

    Buy cheap LED & Semiconductor Industry - Diamond Dicing Blades For Semiconductor Industry - zoe@moresuperhard.com from wholesalers
     
    Buy cheap LED & Semiconductor Industry - Diamond Dicing Blades For Semiconductor Industry - zoe@moresuperhard.com from wholesalers
    • Buy cheap LED & Semiconductor Industry - Diamond Dicing Blades For Semiconductor Industry - zoe@moresuperhard.com from wholesalers
    • Buy cheap LED & Semiconductor Industry - Diamond Dicing Blades For Semiconductor Industry - zoe@moresuperhard.com from wholesalers
    • Buy cheap LED & Semiconductor Industry - Diamond Dicing Blades For Semiconductor Industry - zoe@moresuperhard.com from wholesalers

    LED & Semiconductor Industry - Diamond Dicing Blades For Semiconductor Industry - zoe@moresuperhard.com

    Ask Lasest Price
    Brand Name : moresuperhard
    Model Number : As requested
    Certification : ISO9001-2008
    Payment Terms : L/C, T/T, Western Union, MoneyGram,Paypal
    Supply Ability : 5000pcs/month
    Delivery Time : 7-10 work days
    • Product Details
    • Company Profile

    LED & Semiconductor Industry - Diamond Dicing Blades For Semiconductor Industry - zoe@moresuperhard.com

    Product Details:

    Description:
    Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade.

    Diamond Dicing Blades

    Application:

    For cutting Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

    For cutting Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter

    For cutting Electronic parts, Optical devices, semiconductor packages, BGA, CSP

    For cutting Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon

    Drawing&Specification
    TypesFeaturesProduct Name

    electroplated dicing blade

    Electroformed dicing blade

    Features:

    Easy to handle;

    Variety of different grit concentrations;

    Stable processing performance


    Hub dicing blade

    Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

    More Super Hard Products Co., Ltd

    Resin bond dicing blade

    Features:

    High processing quality for cutting of hard, brittle materials;

    Improved cut quality on hard materials


    Hubless dicing

    blade

    Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter

    metal bond dicing blade


    Metal bond dicing balde

    Features:

    High rigidity minimized wavy&slant cutting;

    Excellent rigidity and cut quality

    Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP,

    Electroformed dicing balde

    Electroformed dicing balde

    Features:

    Wide selection of blade options

    Proprietary thin-blade technology

    Blade thickness - 0.015 mm to 0.3 mm

    Available for both dicing saws and slicers

    Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
    Other specification can be produced according to customer’s requirements
    Quality LED & Semiconductor Industry - Diamond Dicing Blades For Semiconductor Industry - zoe@moresuperhard.com for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: More SuperHard Products Co., Ltd-Zoe Chen
    *Subject:
    *Message:
    Characters Remaining: (0/3000)